The Technology & Maintenance Council (TMC) of American Trucking Associations is accepting scholarship applications for the 2009-2010 academic year for students either pursuing a diesel technology degree from WyoTech, or a diesel technology degree or a bachelor’s degree in specialized studies with a minor in automotive aftermarket management from the University of Northwestern Ohio (UNOH). Deadline is July 1, 2009.
These scholarships are part of an ongoing effort by TMC’s Professional Technician Development Committee (PTDC) to promote professionalism of commercial vehicle technicians. PTDC will help determine the winner of the scholarships. Both schools are active participants in PTDC and have provided the scholarships to promote interest in trucking industry careers through diesel engine repair and service or related maintenance and maintenance management career paths.
WyoTech, a charter member of PTDC, is awarding two tuition scholarships for 1,500 clock hours (nine months) for its diesel program attendance at either of WyoTech’s Laramie WY or Blairsville PA campuses. Students can select from start dates of Sept 28, 2009; Jan 5, 2010; or March 31, 2010.
UNOH, Lima OH, will award a tuition-only only scholarship to a student working toward a degree in auto diesel technology or a bachelor degree in specialized studies with a minor in automotive aftermarket management.
Applicants must have graduated from an accredited vocational, public, private, or parochial high school during the 2008-2009 school year. Both WyoTech and UNOH scholarship applicants must have a sponsor who is a current dues-paying member of TMC or is employed/contracted by a company with at least one current dues-paying TMC member. The application must include a letter of recommendation from that sponsor. The applicant or applicant’s high school counselor must also send TMC a high school transcript showing the most recent three years’ academic performance.
Download application forms at http://tmc.truckline.com or call TMC at 703-838-1763. TMC must receive the complete application package by July 1, 2009.